Trench Probe Fiber Array

In response to advanced SiPh wafer testing demands, Meisu has successfully developed an edge-coupled fiber array capable of interfacing with SiPh ICs featuring trench structures measuring <50μm (width) × 20μm (depth).

The trench probe fiber array can shorten the reflection distance and improve the coupling efficiency by grinding off the cladding at the top of the optical fiber.

This specialized fiber achieves 90-degree light deflection into edge couplers while maintaining low insertion loss and ultra-low optical reflection.